sn965ag30cu05.json
1 { 2 "title": "Lead 217", 3 "alloy": "Sn96.5/Ag3.0/Cu0.5", 4 "melting_point": 217, 5 "temp_range": [30,249], 6 "time_range": [0,330], 7 "reference": "https://www.chipquik.com/datasheets/TS391SNL50.pdf", 8 "stages": { 9 "preheat": [90,150], 10 "soak": [180,175], 11 "reflow": [210,217], 12 "cool": [270,217] 13 }, 14 "profile": [ 15 [0,30], 16 [90,150], 17 [180,175], 18 [210,217], 19 [240,249], 20 [270,217], 21 [330,50] 22 ] 23 }